Lian Li Unveils New PC Cases During 2021 Digital Expo 2.0 Event

Lian Li has unveiled a number of new PC cases, including updated versions of their immensely popular PC-O12W and PC-O8W cases. The company has also introduced a new PC-O3D design that includes a transparent LCD window and an integrated VESA mount for use with an Asus monitor.

The world’s largest electronic products exhibition, the Digital Expo 2.0, is being held in Shenzhen, China, from May 8 to May 11. The product lineup includes a new Type-C Xbox One S, a new mouse, a VR headset, and more. Lian Li will show a new PC case during the event.

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Lian Li, world-famous case manufacturer, has shown off their new cases during their Digital Expo 2.0 event in Shanghai, China.

Image: Lian Li

Lian Li has released information about the 2021 Digital Expo 2.0. The three-part series, which can be seen on the official Lian Li YouTube channel, features several new PC cases and fans. These include the LANCOOL III, an all-new prototype enclosure with hinged glass side panels and covers that extend around the front of the enclosure for easy opening and closing, and the Q58, a small form factor enclosure that offers impressive modularity, heat sink support and cooling performance. Lian Li also shared information about another prototype called UNI FAN SL120 INFINITY, a version of the SL120 modular fan with infinite mirrors.


Image: Lian Li

The first prototype is a newcomer to the LIAN LI range of interlocking fans – the UNI FAN SL120 INFINITY. The INFINITY model is based on a chassis similar to that of the original SL120, but offers an updated look with Infinity mirrors in each corner of the fan, both front and rear. There is also an infinity mirror in the center of the front of the fan and the LIAN LI logo with LED lighting in the center of the back.


Image: Lian Li

The new LANCOOL III has hinged glass side panels and balance panels that extend around the front of the cabinet for easy opening and closing. The front and top panels are equipped with fine mesh for optimal air circulation. The front modular RO can be easily moved to the bottom of the front panel. Inside the enclosure, the lid and panel supports are now removable and modular, making it easier to install fans and heatsinks. An additional compartment for hard drives on rails has been added in the PSU enclosure. The LANCOOL III supports motherboards from Mini-ITX to EATX, graphics cards up to 397 mm, power supply units up to 200 mm, CPU cooling towers up to 176 mm high, up to 10 fans of 120 mm or 4x 140 and 1×120 mm, as well as up to 6 hard drives of 2.5 or 4x 3.5 and 2x 2.5.


Image: Lian Li

The Q58 is a small form factor package that offers modularity, heatsink support and cooling performance. Several improvements have been made to improve both the aesthetics and functionality of the enclosure, including interchangeable/reversible mesh and glass panels. A newly designed chassis supports SFX and ATX power supplies, now without moving the motherboard tray, so three-slot GPUs remain compatible in any configuration. In addition, the front audio cable is now 50mm longer to accommodate more motherboards.


Image: Lian Li

The O11 AIR MINI is a compact workstation enclosure with a fully shielded front panel and shielded top and right side panels for powerful air cooling. With a depth of 400 mm and a width of 288 mm, the O11 AIR MINI supports ATX power supplies, Mini-ITX to E-ATX motherboards and storage systems with up to 6 2.5 or 4 3.5 plus 2.5 drives.

A4-H20 – LIAN LI x DAN Case Cooperation

Image: Lian Li

The A4-H20 is an all-aluminium, space-saving enclosure, developed in collaboration with DAN Case. The overall look of the A4-H2O has been updated with cleaner edges and a new look, with the IO front panel and power switch moved to the left side of the chassis. The A4-H2O is easily customizable and supports a single SSD mounted in the bottom of the case, three-slot GPUs up to 321mm long, and 240 AIOs with a new integrated removable heatsink bracket.


Image: Lian Li

The O11D EVO is a fully reversible enclosure with redesigned mesh panels on the top and right side. Many features have been improved, such as. B. a new snap to release the heatsink bracket next to the motherboard without tools, an improved cable management bar to support 2 SSDs, stronger clips to secure the upper and lower heatsink/fan brackets, and new tray accessories to turn them into hard drive/SSD trays. In addition, development has been completed to make the O11D EVO fully reversible, with an I/O module that can be quickly moved from the front panel to the side panel. German overclocker Der8auer tests the new O11D EVO.


Image: Lian Li

The V3000+ is a modern chassis that supports dual systems, multiple motherboard orientations, up to 20 hard drives, and a wide range of heatsink and fan configurations. The front and top panels are now easily removed to unlock the all-mesh panels, and there are new buttons to open the side panels. Inside the enclosure, the hard drive support has been revised. The 10 hard drive bays are now divided into 5 separately removable bays, and there are now 2 drive bays on rails in the chassis area that can accommodate an additional 8 hard drives/SSDs. Renowned PC manufacturer GGF Events takes a closer look at the new V3000+.




In this 3-part series, LIAN LI presents the 2 prototypes UNI FAN SL120 INFINITY and LANCOOL III and goes into detail about the 5 upcoming products: Q58, O11 AIR MINI and A4-H2O, and special guests Der8auer and GGF Events will talk about the changes to O11D EVO and V3000+.

Source: LIAN LEE

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30. June 202130. June 2021Lian Li unveiled its new line of PC cases during an event hosted by the company, in a press release sent to press. The PC cases are for the Lian Li PC-O5S, PC-C5X, and PC-G7 cases. Each case comes with both the windowed panel and the panelless versions that are available for the current cases. The new cases are made from aluminum, use high-quality steel, and are designed in the traditional Lian Li style with the two-tone color scheme.. Read more about lian li sp750 and let us know what you think.

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